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37.0-46.0 GHz GaAs MMIC Balanced Image Reject Mixer
February 2007 - Rev 16-Feb-07
M1005-BD Features
Balanced Image Reject Mixer 12.0 dB Conversion Loss 20.0 dB Image Rejection 33.0 dBm LO to RF Rejection +27.0 dBm Input Third Order Intercept (IIP3) 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010
Chip Device Layout
XM1005-BD
General Description
Mimix Broadband's 37.0-46.0 GHz GaAs MMIC balanced image reject mixer can be used as an up- or down-converter. The device has a conversion loss of 12.0 dB with a 20.0 dB image rejection across the band. I and Q mixer outputs are provided and an external 90 degree hybrid is required to select the desired sideband. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
Parameter Frequency Range (RF) Frequency Range (LO) Frequency Range (IF) RF Return Loss (S11) IF Return Loss (S22) LO Return Loss (S33) Conversion Loss (S21) LO Input Drive (PLO) Image Rejection Isolation LO/RF Isolation LO/IF Isolation RF/IF Input Third Order Intercept (IIP3) 1 Gate Bias Voltage (Vg1)
(1) Down-conversion operation
Absolute Maximum Ratings
Gate Bias Voltage (Vg) Input Power (RF Pin) Input Power (IF Pin) Storage Temperature (Tstg) Operating Temperature (Ta) +0.3 VDC +20.0 dBm +20.0 dBm -65 to +165 OC -55 to +125 OC
Electrical Characteristics (Ambient Temperature T = 25o C)
Units GHz GHz GHz dB dB dB dB dBm dBc dB dB dB dBm VDC Min. 37.0 33.0 DC -2.0 Typ. 10.0 TBD TBD 12.0 +12.0 20.0 33.0 TBD TBD +27.0 -1.2
Max. 46.0 50.0 4.0 +0.1
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Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
37.0-46.0 GHz GaAs MMIC Balanced Image Reject Mixer
February 2007 - Rev 16-Feb-07
M1005-BD Mixer Measurements Down Conversion
WP367_067AA102_XM1005-BD (USB, Down Conversion, IF=2GHz, P R F=-10dBm, PLO= +9, + 12 and +15dBm, VG1B=-1.2V): USB Convers ion gain (dB) vs . RF freq (GHz) and Image Rejection (dBc ) vs . LO freq (GHz)
LO fr eq (GH z) 34 -10 35 36 37 38 39 40 41 42 43 44 45
CG , PLO ( dBm )=9, RC =R 10C1 1 CG , PLO ( dBm )=9, RC =R 10C1 4 CG , PLO ( dBm )=9, RC =R 11C1 1 CG , PLO ( dBm )=9, RC =R 12C1 3 CG , PLO ( dBm )=9, RC =R 13C1 0 CG , PLO (dBm )=12, RC= R1 0C 11 CG , PLO (dBm )=12, RC= R1 0C 14 CG , PLO (dBm )=12, RC= R1 1C 11 CG , PLO (dBm )=12, RC= R1 2C 13 CG , PLO (dBm )=12, RC= R1 3C 10 CG , PLO (dBm )=15, RC= R1 0C 11 CG , PLO (dBm )=15, RC= R1 0C 14 CG , PLO (dBm )=15, RC= R1 1C 11
WP3 67_067AA102_XM1005-BD (LSB, Down Conversion , IF= 2GH z, PR F=-10dBm , PL O=+9, + 12 and +15dBm , VG 1B= -1.2V): LS B Conversio n gain (dB) vs . R F freq ( G Hz) and Image Rejection (dBc) vs . L O freq (G Hz)
LO (GH z) 36 -10
Image Rejec tion (d Bc) / LSB Co nversio n gain (d B)
37
38
39
40
41
42
43
44
45
C L, P LO(dB m)=9, R C =R10C 11 C L, P LO(dB m)=9, R C =R10C 14 C L, P LO(dB m)=9, R C =R11C 11
Image Rejection (d Bc ) / US B Con versio n g ain (dB)
-12 -14 -16 -18 -20 -22 -24 -26 -28 36 37 38 39 40 41 42 43 44 45 46 47 R F freq (GH z)
-12 -14 -16 -18 -20 -22 -24 -26 -28 -30 34 35 36 37 38 39 40 41 42 43 RF fr eq (GHz)
C L, P LO(dB m)=9, R C =R12C 13 C L, P LO(dB m)=9, R C =R13C 10 C L, P LO(dB m)=12, R C =R 10C11 C L, P LO(dB m)=12, R C =R 10C14 C L, P LO(dB m)=12, R C =R 11C11 C L, P LO(dB m)=12, R C =R 12C13 C L, P LO(dB m)=12, R C =R 13C10 C L, P LO(dB m)=15, R C =R 10C11 C L, P LO(dB m)=15, R C =R 10C14 C L, P LO(dB m)=15, R C =R 11C11 C L, P LO(dB m)=15, R C =R 12C13 C L, P LO(dB m)=15, R C =R 13C10 IR , P LO(dB m)=9, R C =R 10C 11 IR , P LO(dB m)=9, R C =R 10C 14 IR , P LO(dB m)=9, R C =R 11C 11 IR , P LO(dB m)=9, R C =R 12C 13 IR , P LO(dB m)=9, R C =R 13C 10 IR , P LO(dB m)=12, R C =R 10C 11 IR , P LO(dB m)=12, R C =R 10C 14 IR , P LO(dB m)=12, R C =R 11C 11 IR , P LO(dB m)=12, R C =R 12C 13 IR , P LO(dB m)=12, R C =R 13C 10 IR , P LO(dB m)=15, R C =R 10C 11 IR , P LO(dB m)=15, R C =R 10C 14 IR , P LO(dB m)=15, R C =R 11C 11 IR , P LO(dB m)=15, R C =R 12C 13 IR , P LO(dB m)=15, R C =R 13C 10
CG , PLO (dBm )=15, RC= R1 2C 13 CG , PLO (dBm )=15, RC= R1 3C 10 IR , P LO (dB m)=9, RC =R 10C1 1 IR , P LO (dB m)=9, RC =R 10C1 4 IR , P LO (dB m)=9, RC =R 11C1 1 IR , P LO (dB m)=9, RC =R 12C1 3 IR , P LO (dB m)=9, RC =R 13C1 0 IR , P LO (dB m)=12, R C =R 10C 11 IR , P LO (dB m)=12, R C =R 10C 14 IR , P LO (dB m)=12, R C =R 11C 11 IR , P LO (dB m)=12, R C =R 12C 13 IR , P LO (dB m)=12, R C =R 13C 10 IR , P LO (dB m)=15, R C =R 10C 11 IR , P LO (dB m)=15, R C =R 10C 14 IR , P LO (dB m)=15, R C =R 11C 11 IR , P LO (dB m)=15, R C =R 12C 13 IR , P LO (dB m)=15, R C =R 13C 10
WP367 _067A A102_XM1005-BD_5dev ices (USB, D own C onv, IF= 2GHz, PLO= +9, + 12 & + 15dBm, VG1B =-1.2V): IP1dB v s . RF( G Hz)
LO (G Hz) 37 0 38 39 40 41 42 43 44 45
IIP1 , PL O ( dBm)=9, R C =R 10C 11 IIP1 , PL O ( dBm)=9, R C =R 10C 14 IIP1 , PL O ( dBm)=9, R C =R 11C 11 IIP1 , PL O ( dBm)=9, R C =R 12C 13 IIP1 , PL O ( dBm)=9, R C =R 13C 10
WP3 67_067AA102_XM1005-BD_5 devic es (LSB , D own C onv, IF =2GH z, PL O=+9, + 12 & +15dB m, VG 1B =-1.2V): IP1 dB vs . R F(G Hz)
LO (G Hz) 33 0 34 35 36 37 38 39 40 41
IIP 1, P LO (dB m)=9, R C =R 10C11 IIP 1, P LO (dB m)=9, R C =R 10C14 IIP 1, P LO (dB m)=9, R C =R 11C11 IIP 1, P LO (dB m)=9, R C =R 12C13 IIP 1, P LO (dB m)=9, R C =R 13C10 IIP 1, P LO (dB m)=12, RC= R 10C1 1 IIP 1, P LO (dB m)=12, RC= R 10C1 4 IIP 1, P LO (dB m)=12, RC= R 11C1 1 IIP 1, P LO (dB m)=12, RC= R 12C1 3 IIP 1, P LO (dB m)=12, RC= R 13C1 0 IIP 1, P LO (dB m)=15, RC= R 10C1 1 IIP 1, P LO (dB m)=15, RC= R 10C1 4 IIP 1, P LO (dB m)=15, RC= R 11C1 1 IIP 1, P LO (dB m)=15, RC= R 12C1 3 IIP 1, P LO (dB m)=15, RC= R 13C1 0 OIP1 , PL O ( dBm)=9, R C =R 10C 11 OIP1 , PL O ( dBm)=9, R C =R 10C 14 OIP1 , PL O ( dBm)=9, R C =R 11C 11 OIP1 , PL O ( dBm)=9, R C =R 12C 13 OIP1 , PL O ( dBm)=9, R C =R 13C 10 OIP 1, P LO ( dB m)=12, R C =R 10C 11 OIP 1, P LO ( dB m)=12, R C =R 10C 14 OIP 1, P LO ( dB m)=12, R C =R 11C 11 OIP 1, P LO ( dB m)=12, R C =R 12C 13 OIP 1, P LO ( dB m)=12, R C =R 13C 10 OIP 1, P LO ( dB m)=15, R C =R 10C 11 OIP 1, P LO ( dB m)=15, R C =R 10C 14 OIP 1, P LO ( dB m)=15, R C =R 11C 11 OIP 1, P LO ( dB m)=15, R C =R 12C 13 OIP 1, P LO ( dB m)=15, R C =R 13C 10
-5
IIP1 , PL O ( dBm)=12, R C =R 10C 11 IIP1 , PL O ( dBm)=12, R C =R 10C 14 IIP1 , PL O ( dBm)=12, R C =R 11C 11 IIP1 , PL O ( dBm)=12, R C =R 12C 13 IIP1 , PL O ( dBm)=12, R C =R 13C 10
-5
OIP1dB / IIP1dB
IIP1 , PL O ( dBm)=15, R C =R 10C 11
-10
OIP1dB / IIP1d B
-10
IIP1 , PL O ( dBm)=15, R C =R 10C 14 IIP1 , PL O ( dBm)=15, R C =R 11C 11 IIP1 , PL O ( dBm)=15, R C =R 12C 13 IIP1 , PL O ( dBm)=15, R C =R 13C 10 OIP 1, P LO (dB m)=9, R C =R 10C 11 OIP 1, P LO (dB m)=9, R C =R 10C 14 OIP 1, P LO (dB m)=9, R C =R 11C 11 OIP 1, P LO (dB m)=9, R C =R 12C 13 OIP 1, P LO (dB m)=9, R C =R 13C 10 OIP 1, P LO (dB m)=12, RC =R 10C 11 OIP 1, P LO (dB m)=12, RC =R 10C 14 OIP 1, P LO (dB m)=12, RC =R 11C 11 OIP 1, P LO (dB m)=12, RC =R 12C 13 OIP 1, P LO (dB m)=12, RC =R 13C 10 OIP 1, P LO (dB m)=15, RC =R 10C 11 OIP 1, P LO (dB m)=15, RC =R 10C 14 OIP 1, P LO (dB m)=15, RC =R 11C 11 OIP 1, P LO (dB m)=15, RC =R 12C 13 OIP 1, P LO (dB m)=15, RC =R 13C 10
-15
-15
-20
-20
-25 35 36 37 38 39 RF (G Hz) 40 41 42 43
-25 35 36 37 38 39 RF (GHz) 40 41 42 43
WP367_067A A102_XM1005-BD (USB , Down Conv, IF = 2GHz , R F1-R F2=100MHz, PR F=-7dB m, VG1B =-1.3V): IIP3 a vg (d Bm) & OI P3 a vg (dBm) vs . RF fre q (G Hz) & LO freq (GH z)
LO freq ( GHz) 33 35 34 35 36 37 38 39 40 41 42
IIP 3, PLO ( dBm) =9, RC =R1 0C1 1 IIP 3, PLO ( dBm) =9, RC =R1 0C1 4 IIP 3, PLO ( dBm) =9, RC =R1 1C1 1 IIP 3, PLO ( dBm) =9, RC =R1 2C1 3 IIP 3, PLO ( dBm) =9, RC =R1 3C1 0
WP 367_067AA102_XM1005-BD (LS B, Down C onv, IF = 2GHz, R F1-RF 2=100MHz, PR F=-7dB m, VG 1B =-1.3V): IIP3 a vg (d Bm ) & O IP3 a vg (d Bm ) v s . RF freq (GHz) & L O fre q (G Hz)
LO fre q (GHz) 37 30 38 39 40 41 42 43 44 45 46
IIP3 , PL O (dBm)=9, R C =R 10C1 1 IIP3 , PL O (dBm)=9, R C =R 10C1 4 IIP3 , PL O (dBm)=9, R C =R 11C1 1 IIP3 , PL O (dBm)=9, R C =R 12C1 3 IIP3 , PL O (dBm)=9, R C =R 13C1 0 IIP3 , PL O ( dBm)=12, R C =R1 0C 11 IIP3 , PL O ( dBm)=12, R C =R1 0C 14 IIP3 , PL O ( dBm)=12, R C =R1 1C 11 IIP3 , PL O ( dBm)=12, R C =R1 2C 13 IIP3 , PL O ( dBm)=12, R C =R1 3C 10 IIP3 , PL O ( dBm)=15, R C =R1 0C 11 IIP3 , PL O ( dBm)=15, R C =R1 0C 14 IIP3 , PL O ( dBm)=15, R C =R1 1C 11 IIP3 , PL O ( dBm)=15, R C =R1 2C 13 IIP3 , PL O ( dBm)=15, R C =R1 3C 10 OIP3 , PL O ( dBm)=9, RC =R 10C 11 OIP3 , PL O ( dBm)=9, RC =R 10C 14 OIP3 , PL O ( dBm)=9, RC =R 11C 11 OIP3 , PL O ( dBm)=9, RC =R 12C 13 OIP3 , PL O ( dBm)=9, RC =R 13C 10 OI P 3, P LO (d B m)=12 , RC =R10 C11 OI P 3, P LO (d B m)=12 , RC =R10 C14 OI P 3, P LO (d B m)=12 , RC =R11 C11 OI P 3, P LO (d B m)=12 , RC =R12 C13 OI P 3, P LO (d B m)=12 , RC =R13 C10 OI P 3, P LO (d B m)=15 , RC =R10 C11 OI P 3, P LO (d B m)=15 , RC =R10 C14 OI P 3, P LO (d B m)=15 , RC =R11 C11 OI P 3, P LO (d B m)=15 , RC =R12 C13 OI P 3, P LO (d B m)=15 , RC =R13 C10
30
IIP 3, PLO (dBm )=12, R C =R 10C 11 IIP 3, PLO (dBm )=12, R C =R 10C 14 IIP 3, PLO (dBm )=12, R C =R 11C 11 IIP 3, PLO (dBm )=12, R C =R 12C 13
25
25
IIP 3, PLO (dBm )=12, R C =R 13C 10 IIP 3, PLO (dBm )=15, R C =R 10C 11 IIP 3, PLO (dBm )=15, R C =R 10C 14
20
IIP3 av g (dB m)
20
IIP 3, PLO (dBm )=15, R C =R 12C 13 IIP 3, PLO (dBm )=15, R C =R 13C 10 OIP3, PLO (dBm )=9, RC= R 10C 11 OIP3, PLO (dBm )=9, RC= R 10C 14 OIP3, PLO (dBm )=9, RC= R 11C 11 OIP3, PLO (dBm )=9, RC= R 12C 13 OIP3, PLO (dBm )=9, RC= R 13C 10 OIP3, PLO (dBm )=12, RC= R10 C 11 OIP3, PLO (dBm )=12, RC= R10 C 14 OIP3, PLO (dBm )=12, RC= R11 C 11 OIP3, PLO (dBm )=12, RC= R12 C 13
IIP3 a vg (dBm)
IIP 3, PLO (dBm )=15, R C =R 11C 11
15
15
10
10
5
OIP3, PLO (dBm )=12, RC= R13 C 10 OIP3, PLO (dBm )=15, RC= R10 C 11 OIP3, PLO (dBm )=15, RC= R10 C 14 OIP3, PLO (dBm )=15, RC= R11 C 11
5
0 35 36 37 38 39 40 41 42 43 44 RF f req f2 (G Hz)
OIP3, PLO (dBm )=15, RC= R12 C 13 OIP3, PLO (dBm )=15, RC= R13 C 10
0 35 36 37 38 39 40 41 42 43 44 RF freq f1 ( GHz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 7
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
37.0-46.0 GHz GaAs MMIC Balanced Image Reject Mixer
February 2007 - Rev 16-Feb-07
M1005-BD Mixer Measurements Up Conversion
WP36 7_067AD102_XM1005-BD ( Up convers ion, U S B , Vg=-1V, IF =2GH z, PIF = -10dB m, PL O= +9 to +18dBm, 21 jan 05): USB C onversio n gain (d B ) vs . RF freq (GHz)
LO fr eq (G Hz) 34 0 -2 -4 -6
US B C onvers ion g ain (dB )
C L, P LO( dB m)=9, = R 5C 10 C L, P LO( dB m)=9, = R 5C 12 C L, P LO( dB m)=9, = R 6C 11 C L, P LO( dB m)=9, = R 7C 10 C L, P LO( dB m)=9, = R 7C 13 C L, P LO( dB m)=12, = R 5C 10 C L, P LO( dB m)=12, = R 5C 12 C L, P LO( dB m)=12, = R 6C 11 C L, P LO( dB m)=12, = R 7C 10 C L, P LO( dB m)=12, = R 7C 13 C L, P LO( dB m)=15, = R 5C 10 C L, P LO( dB m)=15, = R 5C 12 C L, P LO( dB m)=15, = R 6C 11 C L, P LO( dB m)=15, = R 7C 13 C L, P LO( dB m)=15, = R 7C 10 C L, P LO( dB m)=18, = R 5C 10 C L, P LO( dB m)=18, = R 5C 12 C L, P LO( dB m)=18, = R 6C 11 C L, P LO( dB m)=18, = R 7C 10 C L, P LO( dB m)=18, = R 7C 13 IR , P LO( dB m)=9, = R 5C 10 IR , P LO( dB m)=9, = R 5C 12 IR , P LO( dB m)=9, = R 6C 11 IR , P LO( dB m)=9, = R 7C 10 IR , P LO( dB m)=9, = R 7C 13 IR , P LO( dB m)=12, = R 5C 10 IR , P LO( dB m)=12, = R 5C 12 IR , P LO( dB m)=12, = R 6C 11 IR , P LO( dB m)=12, = R 7C 10 IR , P LO( dB m)=12, = R 7C 13 IR , P LO( dB m)=15, = R 5C 10 IR , P LO( dB m)=15, = R 5C 12 IR , P LO( dB m)=15, = R 6C 11 IR , P LO( dB m)=15, = R 7C 10 IR , P LO( dB m)=15, = R 7C 13 IR , P LO( dB m)=18, = R 5C 10
WP3 67_067AD102_XM1005-BD (Up conversion , L S B , Vg =-1V, IF=2GH z, PLO= +9 to +18dB m, PIF = 10dB m, 21 jan 0 5): LSB Convers ion ga in (dB ) vs . RF fre q (GHz)
C L, P LO( dB m)=9, =R 5C 10
LO fr eq (GHz ) 34 0 -2 -4 -6 -8 35 36 37 38 39 40 41 42 43 44 45
C L, P LO( dB m)=9, =R 5C 12 C L, P LO( dB m)=9, =R 6C 11 C L, P LO( dB m)=9, =R 7C 10 C L, P LO( dB m)=9, =R 7C 13 C L, P LO( dB m)=12, =R 5C 10 C L, P LO( dB m)=12, =R 5C 12 C L, P LO( dB m)=12, =R 6C 11 C L, P LO( dB m)=12, =R 7C 10 C L, P LO( dB m)=12, =R 7C 13 C L, P LO( dB m)=15, =R 5C 10 C L, P LO( dB m)=15, =R 5C 12 C L, P LO( dB m)=15, =R 6C 11 C L, P LO( dB m)=15, =R 7C 10 C L, P LO( dB m)=15, =R 7C 13 C L, P LO( dB m)=18, =R 5C 10 C L, P LO( dB m)=18, =R 5C 12 C L, P LO( dB m)=18, =R 6C 11 C L, P LO( dB m)=18, =R 7C 10 C L, P LO( dB m)=18, =R 7C 13 IR , P LO( dB m)=9, =R 5C1 0 IR , P LO( dB m)=9, =R 5C1 2
35
36
37
38
39
40
41
42
43
44
45
LSB Co nversion gain (dB)
-8 -10 -12 -14 -16 -18 -20 -22 -24 -26 -28 36 37 38 39 40 41 42 43 44 45 46 47 R F fre q (G Hz)
-10 -12 -14 -16 -18 -20 -22 -24 -26 -28 32 33 34 35 36 37 38 39 40 41 42 43 RF fr eq (GHz )
IR , P LO( dB m)=9, =R 6C1 1 IR , P LO( dB m)=9, =R 7C1 0 IR , P LO( dB m)=9, =R 7C1 3 IR , P LO( dB m)=12, =R 5C 10 IR , P LO( dB m)=12, =R 5C 12 IR , P LO( dB m)=12, =R 6C 11 IR , P LO( dB m)=12, =R 7C 10 IR , P LO( dB m)=12, =R 7C 13 IR , P LO( dB m)=15, =R 5C 10 IR , P LO( dB m)=15, =R 5C 12 IR , P LO( dB m)=15, =R 6C 11 IR , P LO( dB m)=15, =R 7C 10 IR , P LO( dB m)=15, =R 7C 13 IR , P LO( dB m)=18, =R 5C 10 IR , P LO( dB m)=18, =R 5C 12 IR , P LO( dB m)=18, =R 6C 11 IR , P LO( dB m)=18, =R 7C 10 IR , P LO( dB m)=18, =R 7C 13
IR , P LO( dB m)=18, = R 5C 12 IR , P LO( dB m)=18, = R 6C 11 IR , P LO( dB m)=18, = R 7C 10 IR , P LO( dB m)=18, = R 7C 13
WP367_067AD102_XM1005-BD (Up conv ersion , U S B, Vg =-1V, IF= 2GHz , PIF = -10dBm, PLO= +9 to +18dB m, 21 jan 05 ): LO t o RF gain (dB ) vs . RF freq (G Hz)
0
WP367_067AD102_XM1005-BD (C onversion, LSB, Vg=- 1V, IF=2GHz, P IF = -10 dBm, PLO= +9 to +18dBm, 21 j an 0 5): LO to RF gain (dB) v s . RF fre q (GHz)
0
-5
-5
LO is o, PLO( dBm)=9, =R5C10
-10
LO iso, P LO(dB m)=9, =R 5C 10
LO is o, PLO( dBm)=9, =R5C12 LO is o, PLO( dBm)=9, =R6C11 LO is o, PLO( dBm)=9, =R7C10 LO is o, PLO( dBm)=9, =R7C13
-10
LO iso, P LO(dB m)=9, =R 5C 12 LO iso, P LO(dB m)=9, =R 6C 11 LO iso, P LO(dB m)=9, =R 7C 10 LO iso, P LO(dB m)=9, =R 7C 13 LO iso, P LO(dB m)=12, =R 5C 10 LO iso, P LO(dB m)=12, =R 5C 12 LO iso, P LO(dB m)=12, =R 6C 11 LO iso, P LO(dB m)=12, =R 7C 10 LO iso, P LO(dB m)=12, =R 7C 13 LO iso, P LO(dB m)=15, =R 5C 10 LO iso, P LO(dB m)=15, =R 5C 12 LO iso, P LO(dB m)=15, =R 6C 11 LO iso, P LO(dB m)=15, =R 7C 10 LO iso, P LO(dB m)=15, =R 7C 13 LO iso, P LO(dB m)=18, =R 5C 10 LO iso, P LO(dB m)=18, =R 5C 12 LO iso, P LO(dB m)=18, =R 6C 11
LO to RF gai n (dB)
-15
LO is o, PLO( dBm)=12, =R 5C10 LO is o, PLO( dBm)=12, =R 6C11 LO is o, PLO( dBm)=12, =R 7C10 LO is o, PLO( dBm)=12, =R 7C13 LO is o, PLO( dBm)=15, =R 5C10 LO is o, PLO( dBm)=15, =R 5C12 LO is o, PLO( dBm)=15, =R 6C11 LO is o, PLO( dBm)=15, =R 7C10
-20
L O to RF gain (dB)
LO is o, PLO( dBm)=12, =R 5C12
-15
-20
-25
LO is o, PLO( dBm)=15, =R 7C13 LO is o, PLO( dBm)=18, =R 5C10 LO is o, PLO( dBm)=18, =R 5C12 LO is o, PLO( dBm)=18, =R 6C11
-25
-30
LO is o, PLO( dBm)=18, =R 7C10 LO is o, PLO( dBm)=18, =R 7C13
-30
LO iso, P LO(dB m)=18, =R 7C 10 LO iso, P LO(dB m)=18, =R 7C 13
-35
-35
-40 36 37 38 39 40 41 42 43 44 45 46 47
-40 32 33 34 35 36 37 38 39 40 41 42 43 RF fr eq (GHz )
RF freq (GHz)
WP3 67_067AD102_XM1005-BD (Up C onversi on, U S B , IF =2GHz, IF1-IF2=100MHz, PI F=-5dB m, PL O=+9 to +15dB m, V g=-1.25V, 24 Ja n ary 04): IIP3 (dBm ) vs . RF freq (G Hz) & O IP3 (dB m) vs . L O freq (G Hz)
LO fr eq (GH z) 34 30 35 36 37 38 39 40 41 42 43 44 45
WP 367_067AD102_XM1005-BD (Up Conversion, LSB, I F=2GHz, IF1 -IF2=100MHz, P IF=-5dB m, PLO=+ 9 to +15dBm, Vg= -1.25V, 24 Ja n ary 04): IIP3 (dBm ) vs . RF freq (GHz) & O IP3 (dBm) v s . L O fre q (GHz )
LO fr eq (G Hz) 34 35 36 37 38 39 40 41 42 43 44 45
IIP3 , PL O ( dBm )=9, RC =R 5C 10 IIP3 , PL O ( dBm )=9, RC =R 5C 12 IIP3 , PL O ( dBm )=9, RC =R 6C 11 IIP3 , PL O ( dBm )=9, RC =R 7C 10 IIP3 , PL O ( dBm )=9, RC =R 7C 13 IIP3 , PL O ( dBm )=12, R C =R 5C1 0
25
20
15
10
5
IIP 3, P LO (dB m)=9, RC =R 5C10 IIP 3, P LO (dB m)=9, RC =R 5C12 IIP 3, P LO (dB m)=9, RC =R 6C11 IIP 3, P LO (dB m)=9, RC =R 7C10 IIP 3, P LO (dB m)=9, RC =R 7C13 IIP 3, P LO (dB m)=12 , RC =R5C10 IIP 3, P LO (dB m)=12 , RC =R5C12 IIP 3, P LO (dB m)=12 , RC =R6C11 IIP 3, P LO (dB m)=12 , RC =R7C10 IIP 3, P LO (dB m)=12 , RC =R7C13 IIP 3, P LO (dB m)=15 , RC =R5C10 IIP 3, P LO (dB m)=15 , RC =R5C12 IIP 3, P LO (dB m)=15 , RC =R6C11 IIP 3, P LO (dB m)=15 , RC =R7C10 IIP 3, P LO (dB m)=15 , RC =R7C13 OI P 3, P LO ( dB m)=9, RC=R5C 10 OI P 3, P LO ( dB m)=9, RC=R5C 12 OI P 3, P LO ( dB m)=9, RC=R6C 11 OI P 3, P LO ( dB m)=9, RC=R7C 10 OI P 3, P LO ( dB m)=9, RC=R7C 13 OI P 3, P LO ( dB m)=12, RC=R5 C10 OI P 3, P LO ( dB m)=12, RC=R5 C12 OI P 3, P LO ( dB m)=12, RC=R6 C11 OI P 3, P LO ( dB m)=12, RC=R7 C10 OI P 3, P LO ( dB m)=12, RC=R7 C13 OI P 3, P LO ( dB m)=15, RC=R5 C10 OI P 3, P LO ( dB m)=15, RC=R5 C12 OI P 3, P LO ( dB m)=15, RC=R6 C11 OI P 3, P LO ( dB m)=15, RC=R7 C10 OI P 3, P LO ( dB m)=15, RC=R7 C13
25
20
OIP 3 avg (dBm ) / IIP 3 av g (dBm)
IIP3 , PL O ( dBm )=12, R C =R 5C1 2 IIP3 , PL O ( dBm )=12, R C =R 6C1 1 IIP3 , PL O ( dBm )=12, R C =R 7C1 0 IIP3 , PL O ( dBm )=12, R C =R 7C1 3
OIP3 avg (dBm ) / IIP3 avg (dBm )
15
IIP3 , PL O ( dBm )=15, R C =R 5C1 0 IIP3 , PL O ( dBm )=15, R C =R 5C1 2 IIP3 , PL O ( dBm )=15, R C =R 6C1 1 IIP3 , PL O ( dBm )=15, R C =R 7C1 0 IIP3 , PL O ( dBm )=15, R C =R 7C1 3
10
OI P3, P LO (d B m)=9, R C =R 5C 10 OI P3, P LO (d B m)=9, R C =R 5C 12 OI P3, P LO (d B m)=9, R C =R 6C 11 OI P3, P LO (d B m)=9, R C =R 7C 10
5
OI P3, P LO (d B m)=9, R C =R 7C 13 OI P3, P LO (d B m)=12, RC =R5C1 0 OI P3, P LO (d B m)=12, RC =R5C1 2 OI P3, P LO (d B m)=12, RC =R6C1 1
0
OI P3, P LO (d B m)=12, RC =R7C1 0 OI P3, P LO (d B m)=12, RC =R7C1 3 OI P3, P LO (d B m)=15, RC =R5C1 0 OI P3, P LO (d B m)=15, RC =R5C1 2
-5 32 33 34 35 36 37 38 39 40 41 42 43 RF fr eq (G Hz)
OI P3, P LO (d B m)=15, RC =R6C1 1 OI P3, P LO (d B m)=15, RC =R7C1 0 OI P3, P LO (d B m)=15, RC =R7C1 3
0 36 37 38 39 40 41 42 43 44 45 46 47 RF fre q ( G Hz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 7
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
37.0-46.0 GHz GaAs MMIC Balanced Image Reject Mixer
February 2007 - Rev 16-Feb-07
M1005-BD
0.879 (0.035) 1.279 (0.050)
Mechanical Drawing
2.100 (0.083)
XM1005-BD
2
3
4
1.350 (0.053)
0.693 (0.027)
1
5
0.750 (0.030)
0.0
6
0.0
0.879 (0.035)
1.590 (0.063)
(Note: Engineering designator is 40IRM0540) Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All Bond Pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.592 mg. Bond Pad #1 (RF) Bond Pad #2 (IF1)
Vg1a
Bond Pad #3 (Vg1a) Bond Pad #4 (LO)
Bond Pad #5 (Vg1b) Bond Pad #6 (IF2)
Bias Arrangement IF1
XM1005-BD
2
3
Bypass Capacitors - See App Note [2]
4
LO
RF
1
5
Vg1b
6
IF2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 7
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
37.0-46.0 GHz GaAs MMIC Balanced Image Reject Mixer
February 2007 - Rev 16-Feb-07
M1005-BD
App Note [1] Biasing - The pHEMT mixer devices are operated using a separate gate voltage Vg1a or Vg1b. Set Vg1a or Vg1b=-1.2V for optimum conversion loss performance. Bias can be applied through Vg1a or Vg1b. App Note [2] Bias Arrangement - Each DC pad (Vg1a, Vg1b) needs to have DC bypass capacitance (~100-200 pF) as close to the device as possible. Additional DC bypass capacitance (~0.01 uF) is also recommended. App Note [3] USB/LSB Selection -
LSB
USB
For Upper Side Band Operation (USB): With IF1 and IF2 connected to the direct port (0) and coupled port (90) respectively as shown in the diagram, the USB signal will reside on the isolated port. The input port must be loaded with 50 ohms. For Lower Side Band Operation (LSB): With IF1 and IF2 connected to the direct port (0) and coupled port (90) respectively as shown in the diagram, the LSB signal will reside on the input port. The isolated port must be loaded with 50 ohms.
IF2
IF1
Note: The coupled port can be use d as an alternate input but the port loca tion of the Coupled and Direct ports reverse.
An alternate method of Selection of USB or LSB:
USB
LSB
In Phase Combiner
In Phas e Combiner
-90 o
-90 o
IF2
IF1
IF2
IF1
Page 5 of 7
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
37.0-46.0 GHz GaAs MMIC Balanced Image Reject Mixer
February 2007 - Rev 16-Feb-07
M1005-BD Device Schematic
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 6 of 7
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
37.0-46.0 GHz GaAs MMIC Balanced Image Reject Mixer
February 2007 - Rev 16-Feb-07
M1005-BD Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: * Do not ingest. * Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. * Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The work station temperature should be 310 C +/- 10 C. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement. Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible. RoHS Compliant Parts - All Mimix products are RoHS compliant unless specifically ordered with Tin-Lead finish.
Ordering Information
Part Number for Ordering XM1005-BD-000V XM1005-BD-EV1
Description "V" - vacuum release gel paks XM1005-BD die evaluation module
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 7 of 7
Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.

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